SYS-211SE-31DS
SUPERMICRO SUPERSERVER
SPECIFICATIONS
Product SKUs
SuperServer SYS-211SE-31DS (Silver)
Motherboard
Super X13SEED-SF
Processor (per Node)
CPU
  • Single Socket E (LGA-4677)
  • 4th Gen Intel® Xeon® Scalable processors
Cores
  • Up to 20C/40T; Up to 60MB Cache
Note
  • Supports 85W - 300W TDP CPUs (Aircooled)
  • CPUs (air cooled) with TDP over 205W are only supported under specific conditions.  Contact customer support for details.
System Memory (per Node)
Memory
  • Memory Capacity: 8 DIMM slots
  • Up to 2TB: DDR5 ECC RDIMM/RDIMM
  • Memory Type: 4800MHz ECC DDR5 RDIMM/LRDIMM
Memory Voltage
  • 1.1 V
Error Detection
  • ECC
On-Board Devices (per Node)
Chipset
  • Intel® C741
Network Connectivity
  • 1x 1GbE SFP
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Input / Output (per Node)
LAN
  • 1 SFP GbE LAN port (Shared NIC
Video
  • 1 VGA port(s)
Serial Port
  • 1 COM Port(s) (1 COM)
Others
  • 1 KVM dongle (output VGA x1, COM x1, USB 2.0 x2 through KVM cable)
Management
Software
  • SuperDoctor® 5
  • IPMI 2.0
Power Configurations
  • ACPI Power Management
  • Power-on mode for AC power recovery
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Pulse Width Modulated (PWM) fan connectors
  • Status monitor for speed control
Temperature
  • CPU thermal trip support, PEPI
  • Monitoring for CPU and chassis environment
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-SE201-R2K06P
Note
  • 16.9" (430mm) chassis depth
  • Front access IO design, and tool less serviceability
  • Three front hot-swappable nodes with single CPU socket and 8 DIMM design
Dimensions and Weight
Height
  • 3.5" (88mm)
Width
  • 17.7" (449mm)
Depth
  • 16.9" (430mm)
Package
  • 9.5" (H) x 29.5" (W) x 23.2" (D)
Weight
  • Net Weight: 55.1 lbs (25 kg)
  • Gross Weight: 70.6 lbs (32 kg)
Available Color
  • Silver
Front Panel
Buttons
  • Power On/Off 
  • UID button
LEDs
  • LAN1 activity
  • Power status
  • System information
Expansion Slots (per Node)
PCI-Express (PCIe)
  • 1 PCIe 5.0 x16 LP slot(s)
  • 2 PCIe 5.0 x16 FHHL slot(s)
Drive Bays / Storage (per Node)
Drive Bays
  • N/A
M.2
  • 2 M.2 NVMe
  • M-Key, 2280/22110
System Cooling
Air Shroud
  • 3 Air Shroud(s)
Fans
  • 12x 8cm heavy duty fans with optimal fan speed control 40x56mm Fan(s)
Power Supply
2000W Redundant DC -48V Power Supplies with PMBus
Total Output Power
  • 2000W : (-44) - (-60) Vdc
Dimension

(W x H x L)
  • 73.5 x 40 x 265 mm
+12V
  • Max: 166.6A
12V SB
  • Max: 4A
Certification    

  [ Test Report ]
Operating Environment
Environmental Spec.
  • Operating Temperature:
       0°C ~ 35°C (32°F ~ 95°F)
  • Non-operating Temperature:
       -40°C to 70°C (-40°F to 158°F)
  • Operating Relative Humidity:
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity:
       5% to 95% (non-condensing)
Note
  • Operating Temperature (CPU TDP up to 300W) : Continuous0°C to 35°C (32°F to 95°F)
  • Operating Temperature(CPU TDP up to 205W): Continuous 0°C ~ 35°C (32°F ~ 95°F), Short term -5°C ~ 55°C (23°F ~ 131°F)


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